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DIMM steht für Dual Inline Memory Module und bedeutet doppelreihiger Speicherbaustein. SO-DIMM steht für Small Outline Dual Inline Memory Module. Diese Speichermodule werden meist in Notebooks eingesetzt. Low-Profile-DIMM Module und Very-Low-Profile-DIMM Module werden hauptsächlich in Servern und Daten-Centern eingesetzt.
Column Access Strobe (CAS) latency is the time the memory takes to access a certain part, counted in clock cycles. Lower value are preferred when overclocking memory, and for program that access memory often.
Row Address (RAS) to Column Address (CAS) Delay. When memory controller sends a row address, it takes this many cycles before accessing one of the row's columns. If a row hasn't been selected, it takes this many cycles( tRCD + CAS Latency) to get result from the RAM.In a row with numbers (7-8-7-24), the second value is tRCD.
Row Precharge Time (tRP) = Cycles it takes for a chosen row to change to another. Often written as a row with numbers (7-8-7-24), where the third value is tRP
Row Active Time (tRAS) - Minimum number of cycles that a row has to be active, to ensure enough access time to stored information. Usually greater than or equal to the sum of the previous three latencies (CAS Latency + tRCD + tRP = tRAS). Often written as a row with numbers (7-8-7-24), where the last value is tRAS.
ECC ECC (Error correction code) memory has a chip that detects and corrects memory error. Used in workstations and servers where avoiding errors is crucial. Motherboard support for ECC memory is require for use.
Intel XMP XMP (xtreme memory profile) are profiles tested by Intel and allows for automatic overcloking and faster speeds.
Registered On Registered or buffered memory there is a buffer between memory and controller. Often used in servers as it reduces electrical load and allows for better scalability. Motherboard support for registered memory is require for use.